torx147l(f,t) 2005-06-20 1 fiber optic receiving module torx147l(f,t) fiber optic receiving module for digital audio interface z for jeita standard cp ? 1212 (digital audio optical interface for consumer equipment). z a self ? tapping hole for easy attachment to audio equipments panels. z shutter system 1. maximum ratings (ta = 25c) characteristics symbol rating unit storage temperature t stg ? 40 to 70 c operating temperature t opr ? 20 to 70 c supply voltage v cc ? 0.5 to 4.5 v high level output current i oh ? 2 ma low level output current i ol 2 ma soldering temperature t sol 260 (note 1) c note 1: soldering time 10 seconds (at a distance of 1 mm from the package). 2. recommended operating conditions characteristics symbol min typ. max unit supply voltage v cc 2.7 3.0 3.6 v unit: mm shutter color black pin connection 1. output 2. gnd 3. vcc
torx147l(f,t) 2005-06-20 2 3. electrical and optical characteristics (ta = 25 c , v cc = 3 v) characteristics symbol test condition min typ. max unit data rate nrz code (note 2) 0.1 --- 15 mb / s transmission distance using apf (note 3), using totx147l(f,t) 0.2 --- 5 m pulse width distortion (note 4) S t w pulse width = 67 ns pulse cycle = 134 ns c l = 10 pf using totx147l(f,t) ? 15 --- 15 ns maximum receivable power (note 5) p max 15 mb / s, using apf ? 14.5 --- --- dbm minimum receivable power (note 5) p min 15 mb / s, using apf --- --- ? 24 dbm current consumption i cc --- 10 15 ma high level output voltage v oh 2.1 2.5 --- v low level output voltage v ol --- 0.2 0.4 v note 2: 7.5mb/s (max.) biphase signal. when modulated optical high level signal is received, output signal is high. when modulated optical low level signal is received, output signal is low. when non ? modulated signal (optical all high or all low level signal) is inputted, output signal is not stable. note 3: all plastic fiber (980 / 1000 m). note 4: between input of totx147l(f,t) and output of torx147l(f,t). note 5: ber 10 ? 9 , peak value. 4. mechanical characteristics (ta = 25c) characteristics symbol test condition min typ. max unit insertion force (note 6) initial value --- --- 39.2 n withdrawal force (note 6) initial value 5.9 --- 39.2 n torque for self ? tap using self ? tapping screw (m3 8) 58.8 --- 98 ncm note 6: square type connector : eiaj rc-5720b 5. application circuit 6. required optical fiber with fiber optic connectors all plastic fiber with square type connector ( eiaj rc-5720b )
torx147l(f,t) 2005-06-20 3 7. board layout hole pattern (recommendation) unit: mm tolerance: 0.05 mm recommended pcb thickness: 1.6 mm 8. precautions on use (1) maximum rating the maximum ratings are the limit values which must not be exceeded during operation of device. none of these rating value must not be exceeded. if the maximum rating value is exceeded, the characteristics of devices may never be restored properly. in extreme cases, the device may be permanently damages. (2) soldering optical modules are comprised of internal semiconductor devices. however, in principle, optical modules are optical components. during soldering, ensu re that flux does not contact with the emitting surface or the detecting surface. also ensure that proper flux removal is conducted after soldering. some optical modules come with shutter system. the shutter is closed to avoid malfunction when the optical module is not in use. note that it is not dust or waterproof. as mentioned before, optical modules are optical components. thus, in principle, soldering where there may be flux residue and flux removal after soldering is not recommended. toshiba recommend that soldering be performed without the optical module mounted on the board. then, after the board has been cleaned, the optical module should be soldered on to the board manually. if the optical module cannot be soldered manually, use non ? halogen (chlorine ? free) flux and make sure, without cleaning, there is no residue such as chlorine. this is one of the ways to eliminate the effects of flux. in such a cases, be sure to check the devices' reliability. (3) noise resistance it is believed that the use of optical transfer devices improve noise resistance. in theory, optical fiber is not affected by noise at all. however, receiving modules which handle signals whose level is extremely small, are susceptible to noise. toslink improve noise resistance to use a conductive case. however, the current signal output by the optical receiving modules' photodiode is extremely small. thus, in some environments, shielding the case may not achieve sufficient noise resistance. for systems which incorporate toslink, toshiba recommend testing using the actual device to check its noise resistance. use a simple noise filter on toslink fiber optic transceiving module's power line. if the ripple in the power supply used is significant, reinforce the filter. the optical module is to be used in an area which is susceptible to radiated noise, increase the shielding by covering the optical module and the power line filter with a metallic cover. (4) vibration and shock this module is plastic sealed and has its wire fixed by resin. this structure is relatively resistant to vibration and shock. in actual equipment, there are sometime cases in which vibration, shock, or stress is applied to soldered parts or connected parts, resulting in lines cut. a care must be taken in the design of equipment which will be subject to high levels of vibration. (5) support pins the torx147l(f,t) has support pins in order to fix itself to the pcb temporary. please make the hole for these pins in the pcb under the cond ition described in board layout hole pattern.
torx147l(f,t) 2005-06-20 4 (6) panel attachment torx147l(f,t) has hole for panel attachment. please be sure to attach it to panel with self ? tapping screw. (7) solvent when using solvent for flux removal, do not use a hi gh acid or high alkali solvent. be careful not to pour solvent in to the optical connector ports. if solvent is inadvertently poured in to them, clean it off using cotton tips. (8) supply voltage use the supply voltage within the recommended operating condition (v cc = 2.7 to 3.6v). make sure that supply voltage does not exceed the maximum rating value of 4.5 v, even for an instant. (9) output if the receiver output is at low and is connected to the power supply, or if the output is high and is connected to gnd, the internal ic may be destroyed. (10) soldering condition solder at 260c or less for no more than ten seconds. (11) the hole for chassis please make a hole for inserting optical connector the slash part in the following figure. (12) case(receptacle) material the case is made of polycarbonate. polycarbonate is usually stable with acid, alcohol, and aliphatic hydrocarbons however, with petrochemicals (such as benzene, toluene, and acetone), alkali, aromatic hydrocarbons, or chloric hydrocarbons, polycarbonate becomes cracked, swollen, or melted. please take care when choosing a packaging material by referencing the table below. chemicals to avoid with polycarbonate phenomenon chemicals a little deterioration but staining ? nitric acid(low concentration) , hydrogen peroxide, chlorine b cracked crazed, or swollen ? acetic acid(70% or more) ? gasoline ? methyl isobutyl ketone, ethyl acetate, butyl acetate ? methyl methacrylate, ethyl ether, mek ? acetone, m-amino alcohol, carbon tetrachloride ? carbon disulfide, trichloroethylene, cresol ? thinners, oil of turpentine ? triethanolamine c melted used as solvent ? concentrated sulfuric acid ? benzene ? styrene, acrylonitrile, vinyl acetate ? ethylenediamine, diethylenediamine ? {chloroform, methyl chloride, tetrachloromethane, dioxane} {1,2-dichloroethane} d decomposed ? ammonia water ? other alkali
torx147l(f,t) 2005-06-20 5 (13) precautions when disposing of devices and packing materials. when disposing devices and packing materials, follow the procedures stipulated by local regulations in order to protect the environment against contamination. (14) precautions during use toshiba is continually working to improve the quality and the reliability of their products. nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and their vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba products, to observe standards of safety, and to avoid situations in which the malfunction or failure of a toshiba product could cause loss of human life, bodily injury or damage to property. when developing equipment, please ensure that toshiba products are used within the specified operating ranges set forth in the most recent product specifications. also, please keep in mind the precautions and conditions set forth in the toshiba semiconductor reliability handbook.
torx147l(f,t) 2005-06-20 6 ? toshiba is continually working to improve the quality and reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inhe rent electrical sensitivity and vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within specified operating ranges as set forth in the most recent toshiba products specifications. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semiconductor devices,? or ?toshiba semiconductor reliability handbook? etc.. ? the toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunct ion or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traf fic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. unintended usage of toshiba products listed in this document shall be made at the customer?s own risk. ? gallium arsenide (gaas) is a substance used in the products described in this document. gaas dust and fumes are toxic. do not break, cut or pulverize the product, or use chemicals to dissolve them. when disposing of the products, follow the appropriate regulations. do not disp ose of the products with other industrial waste or with domestic garbage. ? the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba corporation for any infringements of intellectual property or other rights of the third parties which may result from its use. no license is granted by implication or otherwise under any intellectual property or other rights of toshiba corporation or others. ? the information contained herein is subject to change without notice. 000707eac restrictions on product use
|
